Microwave and Millimeter-Wave Electronic Packaging
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Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
Информация за "Microwave and Millimeter-Wave Electronic Packaging"
- SKU 9781608076970
- Weight 0.586000
- ISBN 9781608076970
- Вид корица Hardback
- Издателство Artech House Publishers
- Брой страници 261
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